【征文进行中】Call For Paper—APCSCRM 2023 - 公告通知中关村天合宽禁带半导体技术创新联盟

亚太碳化硅及相关材料国际会议（APCSCRM）自2018年在中国北京举办首届会议以来，目前已经成功举办三届，每届会议均吸引来自欧美日等十余个国家或地区的权威代表参加，历届出席人数累计超过2000人次，共发表近200个报告分享，吸引700余家企业参与，现已成为亚太地区宽禁带半导体产业与学术并重的高水平论坛，得到了社会各界的广泛认可和支持，带动了亚太地区碳化硅等宽禁带半导体产业与学术的强势发展，加快了产业内跨界融合创新与协同驱动发展的进程。

Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM) has been successfully held for three sessions since its first session was held in Beijing, China in 2018. Each session has attracted authoritative representatives from more than ten countries or regions, including Europe, America, and Japan, with a cumulative attendance of over 2000 people. Nearly 200 reports have been published and shared, attracting over 700 enterprises to participate. APCSCRM has become a high-level forum in the Asia Pacific region that places equal emphasis on the wide bandgap semiconductor industry and academia, and has received widespread recognition and support from all sectors of society. It has driven the strong development of the wide bandgap semiconductor industry and academia in the Asia Pacific region, accelerating the process of cross-border integration, innovation, and collaborative development within the industry.

为更好得助力亚太地区碳化硅等宽禁带半导体产业的学术研究、技术进步和产业升级，APCSCRM 2023将于2023年11月08日-10日在中国首都-北京盛大召开，本届会议由中关村天合宽禁带半导体技术创新联盟、中国科学院物理研究所、中国电子材料行业协会半导体材料分会和中国晶体学会联合主办，北京天科合达半导体股份有限公司承办，会议以“开放联通·共筑未来”为主题，聚焦宽禁带半导体相关材料及器件多学科主题，邀请全球60余位知名专家学者、企业领袖、资本机构，通过大会报告、专场报告、高峰论坛、口头报告、项目路演和墙报等形式，分享全球宽禁带半导体技术最新研究进展，交换产业前瞻性观点，展示企业先进成果，促进行业互联互通。

In order to better assist the academic research, technological progress and industrial upgrading of the wide bandgap semiconductor industry in the Asia Pacific region, APCSCRM 2023 will be held in Beijing, the capital of China, on November 8-10, 2023. The conference is hosted by IAWBS, IOP, SMIA and CCrS. Organized by Tankeblue Semiconductor Co., Ltd. APCSCRM 2023 focuses on the multi-disciplinary theme of wide bandgap semiconductor related materials and devices, with the theme of "Open Connectivity · Building the Future Together". More than 60 well-known experts, scholars, business leaders, and capital institutions from around the world are invited to share the latest research progress in global technology through conference reports, special presentations, summit forums, oral reports, project roadshows, and posters.

会议鼓励宽禁带半导体材料生长、器件制备及封装、器件模块应用等领域理论和技术的学习与交流，欢迎国内外高校、科研院所和企事业单位的宽禁带半导体材料、器件、应用等领域的老师、学者、专业技术人员投稿并与会交流!

In order to encourage the learning and exchange of theories and technologies in the fields of wide bandgap semiconductor material growth, device preparation and packaging and device module application, the conference will call for papers.

We welcome scholars, and professional technical personnel from universities, research institutes, and enterprises worldwide in the fields of wide bandgap semiconductor materials, devices, applications, and other fields to submit and participate in exchanges!

组委会评选出的优秀稿件有机会于大会作口头报告或进行海报展示与讲解，并参加优秀海报奖评选，同时被推荐在《半导体学报》投稿发表！

The excellent papers selected by the organizing committee have the opportunity to give oral presentations or poster displays at the conference, and participate in the selection of the Excellent Poster Award. They are also recommended for publication in the Journal of Semiconductors !

1.征稿范围

Scope of Soliciting Contributions

凡以宽禁带半导体为论述主体，在理论或应用实践上具有创新价值的，有科学依据和可靠数据的技术报告，阶段性成果报告，以及属于前沿技术，并对宽禁带半导体学科发展有指导意义的展望评论性论文，均可投稿，主题包括但不限于：

材料与生长（晶体和外延生长、在SiC上生长的新材料等）
缺陷和表征（材料特性、缺陷控制技术、表征技术等）
装备设计、工艺和特性（离子注入、抛光、研磨、切割等）
器件设计和测试（新型器件和特性、建模和仿真、新型测试和表征等）
封装与可靠性及其应用（在可再生能源和储能、交通、电力系统中的应用、可靠性等）
... ...

All technical reports, periodic achievement reports with scientific basis and reliable data, as well as forward-looking and critical papers with broad band gap semiconductors as the main body of discussion and innovative value in theory or application practice, as well as frontier technologies and guiding the development of wide band gap semiconductors can be submitted.Major topics but not limited to:

Materials and growth (crystal and epitaxial growth, new materials grown on SiC)
Defects and characterization (material properties, defect control techniques, characterization techniques, etc.)
Equipment design, process and characteristics (ion implantation, polishing, grinding, cutting)
Device design and testing (new devices and characteristics, modeling and simulation, new testing and characterization)
Packaging and reliability and their applications (applications in renewable energy and energy storage, transportation, and power systems, reliability)
... ...

2.征稿要求

Requirement

（1）只接受英文稿件，摘要或全文均可；

（2）内容具体，突出创新研究成果，具有重要的学术价值或推广应用价值；

（3）原创、综述、工作经验总结或技术进展报告（不涉及任何侵权问题）；

（4）不得涉及国家秘密；

（5）论文篇幅不少于4页。

(1) Only accept English manuscripts, either abstract or full text is acceptable;

(2) Specific content, highlighting innovative research results, with important academic value or promotion and application value;

(3) Original, technical summary, work experience summary, or technical progress report;

(4) State secrets shall not be involved;

(5) The length of the paper shall not be less than 4 pages.

3.投稿流程

Submission Process

（1）作者请移步至会议官网下载专区获取摘要模板：
https://apcscrm2023.casconf.cn/

（2）摘要模板第一页填写作者及文章信息，并标明投稿意向：分为口头报告、Poster或仅投稿；

（3）投稿请将个人信息及投稿稿件发送至邮箱：mishuchu@iawbs.com；

（4）投稿截止日期：2023年10月8日。

(1) Please move to the download section of the conference website to obtain the abstract template: https://apcscrm2023.casconf.cn/

(2) On the first page of the abstract template, fill in the author and paper information, and indicate the intention to submit: oral report, poster, or submission only;

(3) Please send your personal information and submission to email: mishuchu@iawbs.com ;

(4) Submission deadline: October 8, 2023.

4.合作期刊

Cooperative journals

《半导体学报》是中国科学院主管、中国科学院半导体研究所和中国电子学会主办的学术刊物，报道半导体物理、材料、器件、集成电路、工艺及相关领域内的最新科研成果和技术进展。1980年创刊，首任主编是王守武院士，黄昆先生撰写了创刊号首篇论文，2009年改为全英文刊Journal of Semiconductors（简称JOS），同年开始与IOPP英国物理学会出版社合作向全球发行。现任主编是李树深院士。2019年，JOS入选“中国科技期刊卓越行动计划”。2020年，JOS被EI收录。

Journal of Semiconductor (JOS) mainly reports on the latest scientific research achievements and technological progress in semiconductor physics, materials, devices, integrated circuits, processes, and related fields. In 2009, JOS began collaborating with IOPP British Physical Society Press to distribute it globally. In 2020, JOS was included in EI.

2023年6月28日，科睿唯安发布了2022年度《期刊引证报告》（JCR 2022）。《半导体学报》（JOS）首获影响因子为5.1，在Web of Science核心合集凝聚态物理学科收录的共76本期刊（67本SCIE期刊+9本ESCI期刊）中，排在第20名，接近Q1区，总被引频次3344次。

In 2023, Clarivate released the 2022 Journal Citation Report (JCR 2022). JOS has an impact factor of 5.1, ranking 20th out of a total of 76 journals (67 SCIE journals+9 ESCI journals) in the condensed matter physics discipline of the Web of Science core collection, close to the Q1 region, with a total citation frequency of 3344.

期刊投稿链接（Journal submission link）：

https://mc03.manuscriptcentral.com/jos-iop

5.投稿咨询

Submission consultation

刘老师（Ms. Liu）/8610-18931699592

E-mail：mishuchu@iawbs.com

关于会议

About APCSCRM

会议主题

Conference Theme

“开放联通共筑未来第四届亚太碳化硅及相关材料国际会议（APCSCRM 2023）

APCSCRM 2023，Open Connectivity · Building the Future Together