APCSCRM 2024 successfully concluded - 公告通知中关村天合宽禁带半导体技术创新联盟

On November 8, 2024, the three-day 5th Asia Pacific International Conference on Silicon Carbide and Related Materials was grand-closed at Grand Yuntian International Hotel, Pingshan, Shenzhen, China.

The conference was hosted by Innovation Association of Wide Bandgap Semiconductor Technology (IAWBS) and Institute of Physics, Chinese Academy of Sciences, and hosted by TanKeBlue Semiconductor Co., Ltd. and Shenzhen Major Industry Investment Group&Tankeblue Semiconductor Co., Ltd. The conference is themed "Open·Innovation·Collaborative Development", focusing on multiple topics related to wide bandgap semiconductor materials, devices, modules, and applications. It attracted nearly 1,000 experts, scholars and enterprise representatives at home and abroad, and more than 350 enterprises actively participated.

11.06

International Youth Talent Innovation and Development Forum on Wide Bandgap Semiconductors

On November 6, in order to encourage young talents to innovate and develop in the field of wide-gap semiconductors, enhance their influence and competitiveness in the international arena, and promote the exchange of technical views and the collision of cutting-edge ideas, the conference specially set up the "International Youth Talent Innovation and Development Forum on Wide Bandgap Semiconductors", which provided a platform for young scholars and researchers to display their research results.

AM 11.07 Opening Ceremony

On November 7, the conference officially ushered in the opening ceremony. At the opening ceremony, Zhu Yun, member of the Party Group and Deputy director of Shenzhen Development and Reform Commission of Guangdong Province, Liu Wei, chairman of TanKeBlue Semiconductor Co., Ltd., Yuan Huyong, Standing Committee Member and Executive Deputy director of Pingshan District Committee of Shenzhen City, and Daniela Gogova, researcher of Linkoping University, chairman of the conference, delivered important speeches successively.

Zhu Yun, Party member and deputy director of Shenzhen Development and Reform Commission, Guangdong Province

Zhu Yun expressed his congratulations on the convening of this meeting, and introduced in his speech that the Shenzhen Municipal Government attaches great importance to the development of semiconductor and integrated circuit industry, and helps the semiconductor and integrated circuit industry enterprises developing in Shenzhen in various aspects such as the establishment of industrial funds, personnel training, policies and regulations.

Liu Wei, Chairman,TanKeBlue Semiconductor Co., Ltd.

On behalf of TanKeBlue Semiconductor Co., Ltd., the organizer of the conference, Mr. Liu Wei first welcomed all the guests. And said that TanKeBlue is willing to work with the global wide band gap semiconductor parties to build an open, integrated and innovative industrial format, create an international ecological pattern of the wide band gap semiconductor industry, and stimulate the strategic collaborative development of the Asia-Pacific region and even the global wide band gap semiconductor industry.

Yuan Huyong, Standing Committee member and executive deputy district director of Pingshan District Committee of Shenzhen

Mr. Yuan Huyong introduced Pingshan's confidence in the development of the three leading industries of China Core, intelligent vehicles and innovative drugs. According to estimates, by 2030, Pingshan District's annual chip manufacturing capacity will exceed 5 million pieces, and it will truly become a semiconductor town. Pingshan District will BYD and Honor's manufacturing center into an application grasp, to boost the development of chip enterprises in the region.

Daniela Gogova, Research Fellow, Linkoping University

As the president of the conference, Daniela Gogova, a researcher, said that APCSCRM has created an open, innovative and collaborative international environment, gathered world-renowned experts to share the latest research progress, exchange industry forward-looking views, and help the industry to better promote industrialization results, which is an important conference for the global wide band gap industry.

At the end of the opening ceremony, Academician Liu Sheng, Researcher Chen Xiaolong, Professor Chen Jing and Researcher Daniela Gogova, the president of the conference, jointly took the stage to announce the official opening of the conference.

This conference invited more than 60 industry leading experts and entrepreneurs from Sweden, the United States, Malaysia, Japan, Singapore, China, Taiwan and Hong Kong to share the latest research progress of wide band gap semiconductor technology, exchange industry forward-looking views, and display advanced achievements of enterprises. To promote the cooperation and exchange between industry, university, research and application in the wide band gap semiconductor field in the Asia-Pacific region, and promote the academic research, technological progress and high-quality industrial development of wide band gap semiconductor materials and devices!

11.07 Main Forum session

Speech topic: 《Chip Heterogeneous Integration and Packaging Manufacturing》
Sheng LIU, Academician ofChinese Academy ofSciences, Wuhan University Professor

Speech topic:《Crystal growth of silicon carbide by PVT and TSSG》

Xiaolong CHEN, Institute of Physics, CAS, Professor, TanKeBlue Semiconductor Co., Ltd., Chief Scientist

Speech topic:《Heterogenous Wide-Bandgap Semiconductor Power Electronics》

Kevin J . CHEN, The Hong Kong University of Science and Technology, Chair Professor

Speech topic:《Recent Progress of SiC OSEETS》

Noriyuki Iwamuro, University of Tsukuba, Professor

Speech topic:《Silicon and WBG power semiconductor trends and challenges》

Gourab MAJUMDAR, Mitsubishi Electric Corporation, Senior Fellow

Speech topic:《Design of diamond fluid abrasive for SiC substrate processing》

Sen WANG, HENAN UNION PRECISION MATERIAL CO.,LTD., Technical Director

Speech topic:《Industry Leading SiC CP Solutions for Lowest Cost Of Ownership》

Niraj Mahadev, Entegis, Vice President of New Market Business

PM 11.07 Materials and equipment session

Speech topic:《Review for Resonac's SiC Epiwafer Development》

Hiroshi Kanazawa, Resonac, Head of SiC Research and Development Department

Speech topic:《Technical Progress of Large Diameter SiC epitaxy and Ga₂O₃ Industry Development and Challenges》

Huiwang WU, HeBei Poshing Electronics Technology Co., Ltd., Technical Director

Speech topic:《Wide Bandgap Metal Oxide Semiconductors for Future of More's Law》

Xiaohang LI, King Abdullah University of Science&Technology, Associate Professor

Speech topic:《Research on material fabrication and device performance of diamond radiation detector》

Jinfeng ZHANG, Xidian University, Professor

Speech topic:《 Fabrication and Applications of Ultra-wide Bandgap Semiconductor Ga₂O₃ Epitaxial films》

Peigang LI, Beijing University of Posts and Telecommunications, Professor

Speech topic:《Research on Laser Precision Manufacturing Technology of Silicon Carbide》

Xuechun LIN, Institute of Semiconductor, CAS, Professor

Speech topic:《Research on the growth of silicon carbide single crystal by liquid phase method》

Guobin WANG, Beijing Lattice Semiconductor Co., Ltd., Deputy Director of R & D

Speech topic:《Research on SiC epitaxial equipment technology and industrial collaboration》

Shi WANG, Beijing NAURA Microelectronics Equipment Co., Ltd., Product Manager

Speech topic:《Characterization of polishing-related damage locally introduced during CMP in SiC waferusing transmission electron microscopy and mirror projection electron microscopy》

Hideki Sako, Toray Research Center, Inc., Laboratory Chief

Speech topic:《Rapid growth of SiC single crystal in rare-earths cosolvent solution at low temperature using》

YunLEI, Kuming University of Science and Technology, Professor

Speech topic:《Thermal field structure analysis of SiC growth equipment using electric heating method》

Jianing CHEN, SUZHOU UKING SEMICONDUCTOR TECHNOLOGY Co.. Ltd..Vice President

Speech topic:《Polishing Consumables and Process Technology for Silicon Carbide Substrate》

Haiyang AN, Beijing Grish Hitech Co., Ltd., Technical Director

Speech topic:《Advanced Grinding Equipment and Technology Facilitate Mass Production of 8-inch SiC》

Guojing LIU, CETC BEIJING ELECTRONIC EOUIPMENT CO., LTD., Vice President

Speech topic:《Synthesis and mechanism ofSiC nanoparticles from rice husks by low-temperaturemagnesiothermic reduction》

Xuming ZHANG, WUHAN UNIVERSITY OF SCIENCE AND TECHNOLOGY, Professor

Speech topic:《AVANT semi Progress Update on Development of Metrology, Defect Inspection and Electrical PropertyMeasurement Equipment in SiC and Other Semiconductor Manufacturing Process》

Deming TANG, AVANT Semiconductor Equipment Co., Ltd., General Manager

Speech topic:《Application and Research of Homogeneous Epitaxy on 3C-SiC Substrate by Liquid Phase Method》

Junwei YANG, PowerEpi Semiconductor Co.. Ltd.. General Manager

PM 11.07 Devices and Applications session

Speech topic:《SiC Power Semiconductor technology and Progress》

Guoyou LIU, National Key Laboratory of Power Semiconductors and Integration Technology, Associate Director;SouthWest JiaoTong University, Professor