尊敬的业内同仁，您好！

河南厚德钻石科技有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，河南厚德钻石科技有限公司将在NO.96展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

HENAN HOLD DIAMOND TECHNOLOGY COMPANY sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, HENAN HOLD DIAMOND TECHNOLOGY COMPANY will exhibit the latest products and technologies on booth NO.96. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

企业简介/Company profile

河南厚德钻石有限公司是一家专注于金刚石产品研发和技术革新的高新技术企业，通过质量管理体系认证，职业健康安全管理体系认证和环境管理体系认证。公司始创于1995年，自主创新研发的金刚石、金刚石微粉、金刚石破碎及整形料，应用于汽车工业、航空航天、清洁能源、电子、太阳能光伏、半导体衬底材料、光电、散热、空调压缩机、轴承、5G手机背板、石油钻、生物医疗、工程机械、建筑建材及其他超硬材料的切割、研磨和抛光领域

Henan HOLD DIAMOND is a high-tech company which focusing on diamond product research, development and technological innovation, the company founded in 1995, the company independently innovates and develops diamond, diamond powder, crashed diamond powder and reshaped powder, which are used in the cutting, lapping and polishing fields of automotive industry, aerospace, clean energy, electronics, solar photovoltaic, semiconductor wafer substrate materials, optoelectronics, air conditioning compressors, bearings, 5G mobile phone back-planes, oil drills, biomedical, construction machinery, building materials and other super-hard materials.

产品简介/About Production

功能型金刚石微粉

1、HD-AM高强耐磨金刚石微粉

High Strength and Globoid Micron Power

选用MBD高强度金刚石为原料，产品晶型规则，粒度分布集中，经特殊生产工艺及颗粒表面洁净度处理，杂质含量极低，具有良好的分散性及耐磨性。

High-strength diamond is selected as raw material, the product crystal form is regular, the particle size distribution is concentrated, and the impurity content is very low after special production technology and particle surface cleanliness treatment, and it has good dispersion and wear resistance.

适用于金属/钎焊/电镀砂轮、划刀片、聚晶和研磨液，高效切削、研磨和抛光精密陶瓷、光学衬底材料、半导体晶圆衬底材料、蓝宝石和石英等脆性材料。

It is suitable for metal grinding wheels, dicing blades, polycrystalline and slurries, and efficient cutting, grinding and polishing brittle materials such as fine ceramics, optical substrate materials, semiconductor wafer substrate materials, sapphire and quartz.

2、HD-AX高强金刚石线锯微粉

Micron Powder Specialized for Diamond Wire

选用高品级金刚石原料，特殊整形分级工艺，有粒度集中、强度高、颗粒呈块状结构、杂质含量低等特点。

The selection of high-grade diamond raw materials, special shaping and grading process, has the characteristics of concentrated particle size, high strength, block structure of particles, and low impurity content.

适用于电镀金刚线和砂浆切割线，加工光伏硅材料、半导体晶圆材料、蓝宝石等脆性材料的高效切割。

It is suitable for electroplating diamond wire and mortar cutting line, and efficient cutting of brittle materials such as photovoltaic silicon materials, semiconductor wafer materials, and sapphire.

3、HD-AN超细超纯金刚石微粉

Super Fine and High Purity Micron Powder

选用高品级金刚石为原料，采用先进生产工艺，颗粒尺寸达到纳米级，具有纯度高、分散性好等特点。

High-grade diamond is selected as raw material, advanced production technology is adopted, and the particle size reaches the nano level, which has the characteristics of high purity and good dispersion.

适用于研磨膏和抛光液，应用领域生物医药、电子科技、光电、集成电路芯片等。

It is suitable for abrasive paste and polishing slurry, and is used in biomedicine, electronic technology, optoelectronics, photonics, integrated circuit chips, etc.

4、HD-AT团粒金刚石微粉

Aggregated diamond

由精处理金刚石颗粒和特殊粘结剂组成，具有类多晶结构；通过特殊工艺制备成球形磨料，外形圆整，切削刃小，不容易对被加工工件造成深划伤；具有多晶金刚石的各向同性的特性，没有固定的解离面，颗粒耐磨性好；球形颗粒内外结构一致，自锐性良好，切削力稳定。

Composed of fine treated diamond particles and special binder, with polycrystalline like structure；Spherical abrasive prepared by special process, rounded shape, small cutting edge, not easy to cause deep scratches to the workpiece being processed；Isotropic properties of polycrystalline diamond, no fixed dissociation surface, good abrasion resistance of particles；Spherical particles with consistent internal and external structure, good self-sharpening, stable cutting force.

金刚石研磨液配合研磨皮加工蓝宝石晶片、碳化硅晶片、功能陶瓷等硬脆材料，可根据具体要求选择合适的规格和粒度；金刚石研磨垫配合切削液加工微晶玻璃盖板、蓝宝石晶片、碳化硅晶片等硬脆材料，可根据具体要求选择合适的规格和粒度。

Diamond lapping solution with abrasive skins for processing sapphire wafers, silicon carbide wafers, functional ceramics and other hard and brittle materials, suitable specifications and particle sizes can be selected according to specific requirements；Diamond grinding pad with cutting fluid for processing microcrystalline glass cover, sapphire wafer, silicon carbide wafer and other hard and brittle materials, according to specific requirements to choose the appropriate specifications and particle size.

5、HD-PL类多晶金刚石微粉

Polycrystalline-like diamond powder

颗粒表面具有大量锋利的切削刃，切削效率比单晶金刚石微粉提高2-4倍；

类多晶金刚石微粉颗粒表面切削刃小，硬度低，抛光后工件表面Ra值显著降低，抛光精度高；颗粒表面粗糙，与结合剂结合更加牢固，可以显著提高各种金刚石制品中磨料的把持力，提高使用寿命.

The surface of the particles has a large number of sharp cutting edges, and the cutting efficiency is 2-4 times higher than that of Monocrystal diamond powder.

The surface cutting edge of polycrystalline diamond-like powder particles is small, the hardness is low, the Ra value of the surface of the workpiece is significantly reduced after polishing, and the polishing accuracy is high. The surface of the particles is rough, and the bond is more firm, which can significantly improve the holding force of the abrasives in various diamond products and improve the service life.

碳化硅、蓝宝石、陶瓷材料、石英、不锈钢、玻璃等硬脆材料的精密研磨和抛光.

Precision grinding and polishing of hard and brittle materials such as silicon carbide, sapphire, ceramic materials, quartz, stainless steel, glass, etc.

联系方式/Contact:

河南厚德钻石科技有限公司

HENAN HOLD DIAMOND TECHNOLOGY COMPANY

邮箱/Email：

master@holddiamond.com

电话/Tel:

86 13915275233

地址/Address：

河南省柘城县广州路16号
No.16 Guangzhou road,Zhecheng country,Shangqiu city,Henan province.China