尊敬的业内同仁,您好!

南京博思光诚精密科技有限公司诚挚地邀请您参加11月6日-8日中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间,南京博思光诚精密科技有限公司将在NO.94展台上展出最新产品和技术,我们诚挚地邀请您莅临展台,与我们进行深入的交流和探讨,共同探索合作与发展的可能性。

Distinguished delegates,

Nanjing BOSI Kousei Seimitsu Technology Co., Ltd. sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)!

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, Nanjing BOSI Kousei Seimitsu Technology Co., Ltd. will exhibit the latest products and technologies on booth NO.94. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.


企业简介/Company profile


南京博思光诚精密科技有限公司成立于2022年7月4日,注册资金100万。

光诚是一家服务于研磨抛光加工行业的贸易型公司,同时也对销售的设备提供及时优质的快速反应售后服务。

在半导体行业,光诚精密的产品和服务主要集中在切削加工和研磨抛光上应用的设备和辅耗材。光诚精密基于在日本半导体行业的深厚积累,能够对接引入各种国外先进的产品和技术(如NORITAKE减薄砂轮,东丽抛光垫),以及出口销售国内优秀的产品。

光诚始终用高精度的设备、高质量的耗材来支撑客户生产制造上的专业;以谦虚的心态,热情的态度,为客户提供高品质的服务。

秉承【以人为本】的理念,致力于为员工撑起一个遮风挡雨的港湾,为客户提供全方位的人性化服务。

Nanjing BOSI Kousei Seimitsu Technology Co., Ltd.was established on July 4, 2022, with registered capital of 1 million yuan.
Kousei is a trading company serving the grinding and polishing processing industry, and also provides prompt and high-quality after-sales service for the equipment sold.
In the semiconductor industry, Kousei's products and services are mainly focused on equipment and auxiliary consumables applied in cutting and grinding and polishing. Based on the deep accumulation in the semiconductor industry in Japan, Kousei is able to introduce various foreign advanced products and technologies (such as NORITAKE thinning grinding wheels, Toray polishing pads), as well as export and sales of domestic excellent products.

Kousei always uses high-precision equipment and high-quality consumables to support customers' professional production and manufacturing; with a humble attitude and a warm attitude, it provides high-quality services for customers.
Adhering to the philosophy of "people-oriented," it strives to provide employees with a shelter from the wind and rain, and provide customers with comprehensive humanized services.


产品简介/About Production

一、NORITAKE(则武) SiC晶圆减薄砂轮(粗磨/精磨)

NORITAKE SiC Wafer thinning wheels(rough/fine grinding)


砂轮概述:本系列砂轮适用于SiC晶圆的平面减薄

砂轮优点:低负荷磨削、长寿命工作、提高加工精度、降低加工成本

砂轮规格:


砂轮种类

金属结合剂-粗磨

陶瓷结合剂-精磨

磨粒种类

SD

SD

粒度

1000 , 1500 , 2000 ,

2500 , 3000号

8000,12000号

结合度

K ~ M

I ~ J

尺寸

砂轮外径D(mm)

磨齿宽W(mm)

磨齿厚T(mm)

砂轮外径D(mm)

磨齿宽W(mm)

磨齿厚T(mm)

200~300

3~4

7

200~300

3~4

7


Overview: This series of grinding wheels is suitable for plane thinning of SiC wafers

Advantages: low load grinding, long life performance, improved machining accuracy, and reduced machining cost

Wheel Specifications:


Types

Metal bond -

rough grinding

Ceramic bond -

fine grinding

Grain

SD

SD

Grit#

1000 , 1500 , 2000 ,

2500 , 3000

8000,12000

Degree of bonding

K ~ M

I ~ J

Size

Outer diameter

D(mm)

Grinding tooth width

W(mm)

Grinding tooth thickness

T(mm)

Outer diameter

D(mm)

Grinding tooth width

W(mm)

Grinding tooth thickness

T(mm)

200~300

3~4

7

200~300

3~4

7

联系方式/Contact:


路过

雷人

握手

鲜花

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