尊敬的业内同仁,您好!

江苏晶工半导体设备有限公司诚挚地邀请您参加11月6日-8日中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间,江苏晶工半导体设备有限公司将在NO.95展台上展出最新产品和技术,我们诚挚地邀请您莅临展台,与我们进行深入的交流和探讨,共同探索合作与发展的可能性。

Distinguished delegates,

Jiangsu Jinggong Semicon Equipment Co., Ltd. sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)!

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, Jiangsu Jinggong Semicon Equipment Co., Ltd. will exhibit the latest products and technologies on booth NO.95. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.


企业简介/Company profile


江苏晶工半导体设备有限公司致力于半导体设备的研发和制造,现已自主研制出现已自主研制出4-8寸和12寸的全自动倒角机、全自动晶圆单片清洗机、全自动晶圆刷洗机、全自动上蜡机和轮廓仪等。

江苏晶工凭借20多年的生产研发经验,可为客户提供多样化和定制化的工艺解决方案。公司是集研究、开发、制造、销售和服务于一体的科技型公司,可为用户提供全方位的技术支持,客户需求响应及时,设备水平和技术能力在业内久经验证并得到了用户高度认可。

Jiangsu Jinggong Semicon Equipment Co., Ltd.(Short as “JG Semicon”) is committed to the research and development and manufacturing of semiconductor related equipment.

Products include Edge Grinding machine for 4-8 inches and 12 inch wafer, Single wafer cleaning machine,Single wafer brushing machine, wafer waxing coating machine, profiler and etc.

With over 20 years of production and research and development experience, JG Semicon can provide customers with diversified and customized process solutions. The company is a technology-based company that integrates research, development, manufacturing, sales, and solution. We can provide technical support to clients in according to client’s need.

JG Semicon’s equipment and technical capabilities have been proven in the industry and highly recognized by clients.


产品简介/About Production


全自动倒角机(MET-5600)设备为化合物半导体晶圆材料的边形倒角设备,具有丰富的可选功能。具有高精度,高质量磨削表面,极小料损,晶向定位准确,运行状态稳定等特点。设备兼容性强,4-6-8英寸都可加工,适用于半导体晶圆如碳化硅、氮化镓、硅、砷化镓、磷化铟、锗等材料加工。

Wafer Edge Grinding Machine MET-5600 is designed for compound semiconductor wafer materials with the characteristics of high precision, high-quality grinding surface, accurate crystal orientation positioning and easy operation.Machine specification is ready for 4-6-8 inches various material wafer, such as chemical compound semiconductor(Si,SiC,GaN,GaAs,InP, Ge, LT,Sapphire, bonding wafer etc...)

灵活 Flexible

①可在4-6-8寸、12寸范围运用

Can process 4-6-8 inches various material wafer

②变更尺寸时,只需更换工作台及参数

Easily switch to process different size of wafer

③可加工直边、Notch规格

Can process wafer with OF and Notch

④R角大小可调

Adjustable R-angle size

高精度 High-precision

双工作台、粗磨&精磨增加边缘光滑度 封闭式磨抛,设备表面更洁净

Self-developed low damage grinding method can achieve Mirror Finish effect.

高可靠性 High reliability

非接触式自动对位

Self-developed grinding unit ensure the rotation precision of the spindle and improves the surface roughness.

Non-contact centering and measuring method ensure the stable alignment.

全自动单片晶圆清洗机(QX-2000)设备,主要用于清洗SiC衬底/外延表面及背面的尘粒,金属污染物以及其他有机物,设备配备刷洗工位和清洗工位,先用PVA刷子刷洗,配合化学液清洗,经甩干后可有效去除晶圆表面的有机物、颗粒、金属离子等残留物。适用于清洗6、8英寸SiC衬底。

Single wafer cleaning Machine QX-2000 is designed for cleaning the particles, metal pollutants, and other organic substances on the surface of wafer/epitaxial wafer. The machine is equipped with a brushing station and a cleaning station, which first uses a PVA brush to brush and cooperate with chemical cleaning. After drying, it can effectively remove organic matter, particles, metal ions, and other residues on the wafer surface. Suitable for cleaning 6-8 inch wafer.

灵活 Flexible

① 可在6、8寸范围运用

Can process 6, 8inches various material wafer

② 可根据客户要求定制腔位数量,最高可达12腔

The number of cavity positions can be customized according to customer requirements, up to 12 cavities

③ 晶片厚度:320-1000μm

wafer thickness: 320-1000μm

方便的软件配置 Convenient software configuration

① 软件程序提供3个工艺配方存储,每个配方可设置20步程序

The software program provides 3 process recipe storage, and each recipe can be set with 20 step programs

② 工艺配方可进行分层密码管理

The process know how can be managed through password management

③ 伸缩臂移动速度程序内可调

The movement speed of the robot arm is adjustable within the program

清洗效果好 Outstanding cleaning effect

① 可提供清洗工艺配方

Can provide cleaning process know-how

② 通过刷片功能可将衬底颗粒数量控制在30颗(0.3um)以下

The number of particles can be controlled below 30 (0.3um)

③ 金属离子去除效果好

Outstanding metal ion removal effect


联系方式/Contact:


江苏晶工半导体设备有限公司

Jiangsu Jinggong Semicon Equipment Co., Ltd.


邮箱/Email:

christine@jgsemicon.com

电话/Tel:

王婉婷 Christine Wang:15996565255

地址/Address:

江苏省南通市启东经济开发区南苑西路1133号

No. 1133 Nanyuan West Road, Qidong Economic Development Zone, Qidong City, Nantong City, Jiangsu Province


关于会议/About APCSCRM2024


一、会议名称/Conference:

芯时代开放创新·芯机遇合作发展”--第五届亚太碳化硅及相关材料国际会议

Open·lnnovation·Collaborative· Development——the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)


二、时间地点/Date&Venue:

时间:2024年11月6日—11月8日

地点:中国·深圳,深圳坪山格兰云天国际酒店

Date: Nov.6th,2024--Nov.8th,2024

Venue: Grand Skylight International Hotel Shenzhen Pingshan & Yanzi Lake International Convention and Exhibition Center

Location: No.36 Ruifing Road, Pingshan District, Shenzhen, Guangdong, China


三、组织机构/Organization:

四、会议安排/Schedule


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