尊敬的业内同仁，您好！

惠丰钻石股份有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，惠丰钻石股份有限公司作为金牌赞助，将在NO.11、NO.81展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

Huifeng Diamond Co., Ltd. sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic rese

arch, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, Huifeng Diamond Co., Ltd. as a gold sponsor, will exhibit the latest products and technologies on booth NO.11、NO.81. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

企业简介/Company profile

惠丰钻石是一家高新技术企业，坐落于河南省商丘市柘城高新技术金刚石产业基地，拥有150 亩花园式标准化厂区，占地面积 6万平方米。是中国机床工具工业协会超硬材料分会常务理事单位，拥有全资子公司河南省惠丰金刚石有限公司、深圳惠丰半导体有限公司、控股子公司河南克拉钻石有限公司及郑州技术中心。2020年12月公司被国家工信部授予专精特新“小巨人”称号，2021年被国家工信部认定为"人造单晶金刚石微粉"制造业单项冠军产品，2023年第二次被国家工信部认定为专精特新重点“小巨人”称号，公司于2022年7月在北京证券交易所上市，证券代码：839725。

Huifeng Diamond is a high-tech enterprise located in High-Tech Synthetic Diamond Industrial Base of Zhecheng County Shangqiu city Henan Province, with a 150-acre garden-style standardized factory area covering an area of 60,000 square meters. It is an executive director member of the Sub-branch of the China Machine Tool Industry Association for Superhard Materials, owing a wholly owned subsidiary Henan HuiFeng Diamond Co. LTD located in Zhengzhou , and a holding subsidiary Henan Carat Diamond Co., LTD located in Zhecheng, and a shareholding subsidiary Henan Function Diamond Institute Co., LTD, also located in Zhengzhou, and also Zhengzhou technology center. In December 2020, the company was awarded the title of "little giant" by the Ministry of Industry and Information Technology, and in 2021, it was recognized by the Ministry of Industry and Information Technology as the "National Manufacturing Single Item Champion" of synthetic single crystal diamond powder. In 2023, it was recognized for the second time as a key "little giant" by the Ministry of Industry and Information Technology. The company was listed on the Beijing Stock Exchange in July 2022, with stock code number 839725.

产品简介/About Production

一、半导体研磨用 HFD-B

Semiconductor grinding HFD-B

产品特性：产品晶型较规则、粒度分布集中、颗粒形状呈等积体、杂质含量低。

建议用途：适用于碳化硅衬底、硅化玻璃、光学玻璃、陶瓷等材料的切割和抛光。

Product Features: The product has a relative regular crystal particle shape, a concentrated particle size distribution, homogeneous particle shape , and low impurity content.
Recommended Uses: Suitable for cutting and polishing materials such as SiC substrates, silicon glass, optical glass, ceramics, etc

二、半导体切割用 HFD-T

Semiconductor cutting HFD-T

产品特性：原材料采用高强度、高纯度的优质金刚石，晶型规则、粒度分布集中、杂质含量极低、热稳定性好、耐磨性能高。

建议用途：适用于碳化硅衬底切割及光学玻璃、精细陶瓷、宝石、精密轴承、密封件等产品的研磨抛光和金刚石研磨膏、抛光剂的生产。

Product features: The raw material is made of high-strength, high-purity high-quality diamond feedback, with regular particle shape, concentrated particle size distribution, extremely low impurity content, good thermal stability, and high wear resistance.

Recommended Uses: Suitable for cutting SiC substrates and grinding and polishing products such as optical glass, fine ceramics, gemstones, precision bearings, seals, etc., as well as the production of diamond polishing compound and polishing agents.

三、团聚金刚石微粉 HFD-AD

Agglomerated diamond micron powder HFD-AD

惠丰自主研发的团聚金刚石微粉，采用特殊工艺制备多刃化球形结构，在磨削过程中不断产生新的锋利的切削刃，可保持良好的自锐性、较长的寿命和对材料高效磨削，同时能有效改善加工表面质量。产品已成功用于磨头、研磨液、研磨垫等制造，在研磨抛光碳化硅衬底、蓝宝石衬底、微晶玻璃和陶瓷等硬脆材料方面批量使用。

Huifeng's independently developed agglomerated diamond micron powder adopts a special process to prepare a multi edged spherical structure. During the grinding process, new sharp cutting edges are continuously generated, which can maintain good self-sharpening, long service life, and high-efficient grinding of materials, while effectively improving the surface quality of the processed material. The product has been successfully used in the manufacturing of grinding heads, polishing fluids, grinding pads, etc. It is widely used in the grinding and polishing of hard and brittle materials such as SiC substrates, sapphire substrates, microcrystalline glass, and ceramics,etc.

①粒度和产品应用（Sizes and product application）：

型号	原始粒径（μm）	成品粒径(μm)	加工对象
HFD-AD	0.2-0.5	5-20	碳化硅、蓝宝石粗抛
	1-2	20-30	碳化硅、蓝宝石等精磨
	1-3	20-40	陶瓷、晶片等精磨
	3-4	30-60	陶瓷、微晶玻璃等精磨

②应用领域：半导体衬底加工：碳化硅衬底片、蓝宝石衬底片、光学晶片等；陶瓷和玻璃材料加工：氧化锆陶瓷、微晶玻璃等。

Recommended Uses: Semiconductor substrate processing: SiC substrates, sapphire substrates, optical chips, etc; Ceramic and glass material processing: zirconia ceramics, microcrystalline glass, etc.

③包装规格：500ct，1000ct，10000ct等瓶装/袋装

四、表面多刃化金刚石微粉(类多晶）HFD-MC Surface multi edged diamond micro powder（Quasi-Polycrystalline） HFD-MC

产品特性：表面结构粗糙多刃，增强把持力的同时提高锋利度。

适用用途：用于碳化硅衬底、蓝宝石、磁头、硬盘、硬质玻璃和晶体、陶瓷以及硬质合金的超精密研磨和抛光，可作为镀膜添加剂，用于金属模具、工具、部件等镀膜。可用于研磨，一般配制成研磨液来使用，也能制作刀具，切割时不容易产生崩裂。

Product features: The surface structure is rough and multi-edged, which enhances the bonding strength and improving the sharpness;

Recommended Uses: Suitable for ultra precision grinding and polishing of SiC substrates, sapphire, magnetic heads, hard drives, hard glass and crystals, ceramics, and hard alloys. It can be used as a coating additive for metal molds, tools, components, and other coatings. Can be used for grinding, usually formulated as grinding fluid for use, and can also be used to make cutting tools, which are not prone to cracking during cutting.

五、金刚石研磨抛光液

Diamond grinding and polishing slurry

惠丰钻石自主研发生产多种金刚石研磨抛光液产品，包括水溶性、油溶性等不同类型，磨料品种多样，针对不同研磨对象材质，订制合适配方体系，目前产品可满足 LED衬底、光学蓝宝石、手机陶瓷、光学玻璃、精密金属、半导体材料等行业的精密研磨抛光工艺制程。

Huifeng Diamond independently develops and produces a variety of diamond grinding and polishing fluid products, including water-soluble, oil soluble and other types. The abrasive varieties are diverse, and suitable formula systems are customized for different grinding object materials. Currently, the products can meet the precision grinding and polishing process requirements of industries such as LED substrates, optical sapphires, mobile phone ceramics, optical glass, precision metals, semiconductor materials, etc.