尊敬的业内同仁，您好！

清软微视（杭州）科技有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，清软微视（杭州）科技有限公司将在NO.39展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

T-Vision (Hangzhou) Tech Co.,Ltd. sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, T-Vision (Hangzhou) Tech Co.,Ltd. will exhibit the latest products and technologies on booth NO.39. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

企业简介/Company profile

清软微视（杭州）科技有限公司是杭州政府引进、清华大学入股的高新技术企业，致力于半导体视觉领域量检测软件与装备研发，核心团队来自清华大学、中科院、上海微电子等国内顶尖院校和半导体企业，主要关注半导体前道制程的过程缺陷检测，自主研发的针对第三代半导体衬底和外延检测的Omega系列装备，打破了美国和日本产品的市场垄断。

产品简介/About Production

化合物半导体衬底和外延无损检测装备 Omega9880

Omega9880, a Compound Semiconductor Substrate and Epitaxial Nondestructive Testing Equipment

清软微视自主研发的针对化合物半导体衬底和外延无损检测装备的 Omega 系列产品，已经在国内头部客户现场完成验证，该设备打破了国外设备的垄断。Omega 9880 通过表面明场、暗场与光致发光结合的方式对碳化硅衬底、外延片进行扫描成像，并通过自主研发的软件和算法识别出各类缺陷，进而输出相应的结果文档，兼容4/6/8吋衬底和外延检测，广泛应用于SiC衬底终检、外延片来料检和终检等场景。

T-Vision's self-developed Omega series of non-destructive inspection equipment for compound semiconductor SUB and EPI has been successfully validated at leading domestic customer sites. This equipment breaks the monopoly of foreign-made devices. The Omega 9880 performs inspecting imaging on silicon carbide (SiC) SUB and EPI wafers by combining bright field, dark field, and photoluminescence techniques. It identifies various defects through proprietary software and algorithms, then outputs corresponding result documents. It is compatible with 4-inch, 6-inch, and 8-inch SUB and EPI inspections, and is widely used in final inspection of SiC SUB, incoming and final inspection of EPI, and other scenarios.