尊敬的业内同仁，您好！

苏州博宏源设备股份有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，苏州博宏源设备股份有限公司将在NO.35展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

Suzhou Bohongyuan Equipment Co., Ltd. sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, Suzhou Bohongyuan Equipment Co., Ltd. will exhibit the latest products and technologies on booth NO.35. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

企业简介/Company profile

我们是一家充满活力与创新精神的互联网公司，致力于为全球用户提供最先进、最便捷的科技产品与服务。

苏州博宏源设备股份有限公司是专业研发、生产、销售各类高精度单双面研磨抛光设备、单双面减薄设备、环抛机、边缘抛光机、倒角机及2.5D、3D全自动弧面异形精密抛光机的高新技术企业。

主要用于半导体（硅、碳化硅等）、泛半导体（氮化镓、氮化硅、氮化铝等）、光学及3C等行业硬脆材料的单双面高精度的研磨抛光。设备满足产品对高平面度、高平行度的要求，可根据客户需求对产品进行定制，并提供集设备、工艺、辅料及专业化服务为一体的解决方案。

Suzhou Bohongyuan Equipment Co., Ltd. is a high-tech enterprise specializing in research and development, production and sales of all kinds of high-precision single and double side lapping and polishing equipment, single and double side grinding equipment, Circular polishing machine, edge polishing machine, chamfer machine and 2.5D, 3D automatic arc profile precision polishing machine.

The equipment is mainly used for semiconductor (silicon, silicon carbide, etc.), pan-semiconductor (gallium nitride, silicon nitride, aluminum nitride, etc.), optics and 3C industries of hard and brittle materials single-sided high-precision grinding and polishing. The equipment meets the requirements of high flatness and high parallelism of products, and can be customized according to customer needs, and provide a set of equipment, process, accessories and professional services as one of the solutions.

产品简介/About Production

一、SFG300-A-D单面减薄机

SFG300-A-D Single-sided Grinding Machine

SFG300-A-D是面向晶片厂家的研削机。设备主要用于碳化硅等晶圆或晶锭、硅、LED芯片、LT晶体、砷化镓、集成电路、分离器件等的背面减薄，也适用于锗、石英、陶瓷等硬脆材料的精密减薄。根据设备配置，最大可以加工到12"。

SFG300-A-D is a grinding machine for chip manufacturers. The equipment is mainly used for the back grinding of silicon carbide wafers or ingots, silicon, LED chips, LT crystals, gallium arsenide, integrated circuits, separation devices, etc. It is also suitable for the precision thinning of hard and brittle materials such as germanium, quartz, ceramics. Depending on the equipment configuration, it can be processed up to 12".

二、EP150A边缘抛光机

EP150A Edge Polishing Machine

EP150A主要用于硅片、碳化硅、蓝宝石等硬脆材料晶圆边缘倒角面的抛光，包括斜面、外圆面，以及参考面斜面的抛光。目前市场边缘抛光以8寸及12寸晶圆加工为主，且以进口设备为主。该产品专门针对6寸晶圆加工开发，填补市场空白。

EP150A is mainly used for polishing the edge chamfer surface of silicon wafers, silicon carbide, sapphire and other hard and brittle materials, including bevel surface, outer round surface, and reference surface bevel surface. At present, the market edge polishing is mainly based on 8-inch and 12-inch wafer processing, and mainly on imported equipment. This product is specially developed for 6-inch wafer processing to fill the market gap.

三、SAP200-4H2P-FA全自动化学机械抛光机

SAP200-4H2P-FA Full-automatic chemical mechanical polishing machine

SAP200-4H2P-FA主要用于8寸碳化硅、蓝宝石、半导体材料、铌酸锂、玻璃等硬脆材料平行平面的单片单面高精度、高效率抛光。CMP设备高效抛光去除速率、低划痕控制、自动清洗，全自动干进干出优势突出，有效解决产业瓶颈。

SAP200-4H2P-FA is mainly used for 8-inch silicon carbide, sapphire, semiconductor materials, lithium niobate, glass and other hard and brittle materials parallel plane of Single side single piece, high precision and high efficiency polishing. CMP equipment has the advantages of efficient polishing removal rate, low scratch control, automatic cleaning, automatic dry in and dry out, effectively solving the industry bottleneck.