尊敬的业内同仁，您好！

北京特思迪半导体设备有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，北京特思迪半导体设备有限公司将在NO.118展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

Beijing TSD Semiconductor Equipment Co. sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, Beijing TSD Semiconductor Equipment Co. will exhibit the latest products and technologies on booth NO.118. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

企业简介/Company profile

我们是一家充满活力与创新精神的互联网公司，致力于为全球用户提供最先进、最便捷的科技产品与服务。

北京特思迪半导体设备有限公司，是一家拥有自主知识产权的国家高新技术企业，专注于半导体领域超精密平面加工设备的研发、生产和销售。以“引领半导体技术进步，助力客户发展”为使命，致力于成为全球技术领先的半导体设备制造企业。

Beijing TSD Semiconductor Equipment Co., it is a national high-tech enterprise with independent intellectual property rights, focusing on R&D, production and sales of ultra-precision plane processing equipment in the semiconductor field. With the mission of "Leading the Progress of Semiconductor Technology, Assisting Customers to Develop ", we are committed to become a global leading technology manufacturer of semiconductor equipment.

特思迪以更平、更薄、更可靠为技术导向，深耕半导体衬底材料、晶圆制造、半导体器件、先进封装、MEMS等领域的超精密平面加工技术，形成了技术领先，性能优越，工艺稳定的核心技术优势，可提供减薄、抛光、CMP的系统解决方案和工艺设备。

TSD is guided by flatter, thinner and more reliable technology, is deeply engaged in ultra-precision plane processing technology in semiconductor substrate material, wafer fabrication, semiconductor device, advanced packaging, MEMS, etc., forms the core technology advantage of leading technology, superior performance and stable process, and can provide system solutions and process equipment for thinning, polishing and CMP.

产品简介/About Production

一、全自动减薄机

Automatic Thinning Machine

TFG-3200是一款操作简单、功能丰富高精度研削设备，设备配置自动厚度测量和补偿系统，通过驱动减薄砂轮高速旋转，自动研削晶圆至目标精度，工作台可定制，兼顾多尺寸晶圆，设备应用广泛。

TFG-3200 is a simple, feature-rich and high-precision grinding equipment, equipped with an automatic thickness measurement and compensation system, by driving the thinning wheel to rotate at high speed, automatically grinding wafers to the target accuracy, the table can be customized, taking into account multi-size wafers, the equipment is widely used.

二、双面抛光机

Double-side Polisher

双面抛光机分为双面机械抛光和双面化学抛光两种，分别代表双面抛光的粗加工和精加工。主要用于晶片的表面抛光，操作简单，搭配不同的夹具，抛光垫，抛光液可以实现不同材料，不同尺寸，不同厚度的晶片抛光。

Double-sided polishing machine is divided into two kinds of double-sided mechanical polishing and double-sided chemical polishing, respectively, representing the roughing and finishing of double-sided polishing. Mainly used for wafer surface polishing, simple operation, with different fixtures, polishing pads, polishing fluid can achieve different materials, different sizes, different thickness of the wafer polishing.

三、全自动CMP抛光机

Automatic CMP Polishing Machine

全自动CMP抛光机是一款针对薄膜（介质层）的全自动抛光设备，操作便捷，兼容性强，通过更换抛光压头实现不同尺寸晶圆的兼容，采用自动化装片方式，机械手自动取放片，同时搭配双面PVA滚刷进行在线刷洗功能，实现干进干出，用于氧化物、金属、STI、SOI、MEMS等产品的平坦化抛光，应用广泛。

Automatic CMP polishing machine is a automatic polishing equipment for thin film (medium layer), easy to operate, strong compatibility, through the replacement of polishing head to achieve the compatibility of different sizes of wafers, the automatic makeup method, the robot automatically pick up and put pieces, and with double-sided PVA rolling brush online brushing function, dry in dry out, dry out, dry out. It is widely used for flat polishing of oxide, metal, STI, SOI, MEMS and other products.