尊敬的业内同仁，您好！

张家港安储科技有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，张家港安储科技有限公司作为金牌赞助，将在VIP06展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

ZhangJiaGang AnChu Technology CO.,LTD.sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, ZhangJiaGang AnChu Technology CO.,LTD. as a gold sponsor, will exhibit the latest products and technologies on booth VIP06. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

企业简介/Company profile

张家港安储科技有限公司是由在国际知名电子材料企业多年研发和生产经验的博士和专业人才所创立，专注于瞄准世界先进水平的先进电子材料研发、生产和销售。公司已经获得姑苏领军和张家港重点领军创业企业等荣誉、2023年获评江苏省民营科技企业称号并通过江苏省高新技术企业认定。

公司主营产品：配方型功能电子化学品(主要有抛光液、研磨液、清洗液等）以及电子特气安全存储负压钢瓶所需的吸附材料。产品覆盖130到5纳米制程，适用于铜，钴，钨以及氧化硅，硅衬底以及碳化硅衬底表面。

Zhangjiagang Anchu Technology Co., Ltd. (ANCHUTECH) was established by an accomplished entrepreneur and a team of highly skilled professionals with doctoral degrees and extensive experience in R&D, production, and commercialization at globally leading electronic materials companies in the semiconductor industry. ANCHUTECH is dedicated to advancing the research, development, production, and sales of advanced electronic materials, with a mission to deliver superior products and innovative solutions to the semiconductor industry. ANCHUTECH has been honored as Suzhou Leading Enterprise and a Zhangjiagang Key Leading Startup Enterprise. In 2023, ANCHUTECH was recognized as a Private Technology Enterprise of Jiangsu Province and certified as a High-tech Enterprise by Jiangsu Province.

ANCHUTECH’s primary products include formulated functional electronic chemicals (such as polishing slurries, grinding slurries, cleaning solutions, etc.) and adsorbent materials for the safe storage of electronic specialty gases under negative pressures. These products are suitable for semiconductor manufacturing across technology nodes from 130nm to 5nm and beyond, and are designed for processing a variety of semiconductor substrates and materials, including copper, cobalt, tungsten, silicon oxide, silicon, and silicon carbide.

产品简介/About Production

一、碳化硅衬底抛光液

Silicon Carbide Polishing Slurries

碳化硅衬底由于硬度高，脆性大等特点，给抛光带来了极大的难度。安储科技ACTL-WS系列抛光液是一种高效的碳化硅衬底表面抛光产品，在具有较高的材料去除率的同时可获得低表面粗糙度，低缺陷的晶圆表面。而且抛光液可以循环使用，降低了客户的使用成本。

Polishing silicon carbide substrates presents many challenges due to their hardness and brittleness. ANCHUTECH’s ACTL-WS series polishing slurries are specifically formulated for highly efficient silicon carbide substrate polishing. They provide high material removal rates while achieving low SiC surface roughness and minimal defects. Additionally, these slurries are recyclable, helping to reduce overall costs for customers.

二、碳化硅衬底抛光后晶圆清洗液

Cleaning Solution for Silicon Carbide Substrates

传统的碳化硅晶圆抛光后清洗一般都采用RCA工艺清洗，清洗流程长，工艺要求高。安储科技WK系列清洗液是专为碳化硅CMP抛光后有效清洗晶圆表面而设计的配方类清洗液，使用一步清洗，缩减了清洗工艺，清洗效果好，能有效地去除晶圆表面有机物以及颗粒等污染物。

Traditional cleaning of silicon carbide wafers after CMP polishing typically involves the RCA process, which involves a lengthy and complex procedure. Anchu Technology’s WK series cleaning solutions are specifically formulated for effective cleaning of silicon carbide wafer surfaces following CMP polishing. These one-step solutions simplify the process and deliver excellent results by effectively removing organic contaminants and particles from the silicon carbide wafer surface.

三、抛光后清洗液PCMP

Post-CMP Cleaning Solutions

半导体制程中化学机械抛光（CMP）后表面易产生研磨粒子，有机物，金属离子等缺陷。需要通过特殊的功能性化学清洗减少缺陷，提高良率，这是芯片生产中必须的步骤。

安储科技开发了系列PCMP抛光后清洗，产品覆盖130nm至5nm制程，适用于不同材料抛光后的清洗，比如铜，钴，钨以及氧化硅表面等。

In semiconductor manufacturing, chemical mechanical polishing (CMP) process can leave various defects on the wafer substrate surface, such as abrasive particles, organic contaminants, and trace metal ions. Specialized chemical cleaning is essential for removing these defects and improving wafer production yield, and thus making it a critical step in chip production.

ANCHUTECH has developed a range of post-CMP cleaning solutions, suitable for semiconductor wafer processes from technical node of 130nm to 5nm and beyond. These Post-CMP Cleaning solutions are specifically formulated for cleaning substrate surfaces after CMP polishing of various materials, such as copper, cobalt, tungsten, and silicon oxide, etc.

四、电子特气负压存储钢瓶

Electronic Specialty Gas Negative Pressure Storage Cylinders

安储科技开发的电子特气负压存储钢瓶内装多孔材料，具有高比表面积，对磷烷(PH3)和砷烷(AsH3)三氟化硼(BF3)，四氟化锗(GeF4)等电子特气有着很高的吸附能力，储存稳定安全，不会影响气体纯度，释放量高。可以用在半导体离子注入等设备工艺。

ANCHUTECH has developed highly porous adsorbent materials with high surface areas and large adsorption capacity for use in negative pressure storage cylinders designed to store electronic specialty gases. These adsorbent materials provide superior adsorption of electronic specialty gases such as phosphine (PH3), arsine (AsH3), boron trifluoride (BF3), and germanium tetrafluoride (GeF4). The negative pressure storage cylinders containing these adsorbent materials ensure stable and secure storage of those specialty gases, maintaining specialty gas purity and enabling high release specialty gas rates on demand. These negative pressure storage cylinders are ideal for use in semiconductor ion implantation and other related processes.