Welcome to APCSCRM 2024 - 公告通知中关村天合宽禁带半导体技术创新联盟

In recent years, wide bandgap semiconductor materials (SiC, GaN，Ga₂O₃，AlN， Diamond), with its unique physical and chemical properties, has become the preferred material for manufacturing high-temperature-resistant, high-voltage-resistant, high-frequency, high-power, and low loss semiconductor devices. From consumer electronics to industrial electronics, from new energy vehicles to rail transport, from photovoltaic, wind power to AI and other industries, wide bandgap semiconductor materials and devices are expanding the scope of application, has become an important industrial direction to promote the high-quality development of human society.

Based on this, the Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM) has emerged. APCSCRM is committed to building a high-level international conference in the Asia-Pacific region that emphasizes both industry and academia of wide bandgap semiconductors. The conference will provide a comprehensive communication platform that integrates product display, technical exchange, and business discussions for participating enterprises and audiences through plenary reports, oral presentations, poster displays, and new products and new technologies exhibition, etc,.

APCSCRM has been successfully held for four sessions since the first session held in Beijing, China in 2018. The previous conferences attract over a hundred expert representatives from more than ten countries or regions including Europe, America, Japan, South Korea, and Singapore, etc., with a total of more than 2,800 attendances, nearly 250 reports published and shared, and attracting the participation of more than 1500 enterprises. The APCSCRM has led to the strong development of the Asia-Pacific region's wide bandgap semiconductor industry and academics, and accelerated the process of cross-boundary integration of innovation and synergy-driven development within the industry.

To promote industrial technology exchange and application development, and build an open, innovative, and cooperative international cooperation environment, the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024) will be held in Shenzhen, China from November 6th to 8th, 2024. The conference is themed "Open·Innovation·Collaborative Development", focusing on multiple topics related to wide bandgap semiconductor materials, devices, modules, and applications. It invites renowned experts around the world to share the latest research progress, exchange forward-looking views of the industry, showcase the advanced achievements of enterprises of silicon carbide and related wide bandgap semiconductor materials.

We sincerely invite you to attend APCSCRM 2024 to discuss the latest research results and development trends with the experts, scholars, industry and organization representatives from all over the world, to share your research results, to exchange your practical experiences, and to work together an unlimited and brilliant future for the wide bandgap semiconductor industry!

The specific information for APCSCRM 2024 are listed below:

Information

01Conference

Open·Innovation·Collaborative Development——the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)

02Date&Venue

Date: Nov. 6th, 2024 -- Nov. 8th, 2024

Venue: Grand Skylight International Hotel Shenzhen Pingshan & Yanzi Lake International Convention and Exhibition Center

Location: No.36 Ruifing Road,Pingshan District,Shenzhen,Guangdong, China

03Website

https://apcscrm2024.casconf.cn

04Organizations

Hosts:

Innovation Association of Wide Bandgap Semiconductor Technology (IAWBS)

Institute of Physics, Chinese Academy of Sciences (IOP)

Organizer:

Shenzhen Major Industry Investment Group & Tankeblue Semiconductor Co.,Ltd. (MiTK)

TanKeBlue Semiconductor Co., Ltd. (TanKeBlue)

05Highlights

l Unprecedented scale, Experts and bigwigs Gathered;

l Ideas collide and advanced technology exchanges are here;

l International resources converge here for facilitating academy-industry interaction;

l Let's open up, co-operate, innovate, develop and win-win together!

06Program at a glance

07Topics

l Materials Growth and Processing

l Materials Defects and Characterization

l Equipment design, Process and Characteristics

l Device Design, Process and Test

l Device, Module Packaging, Reliability and Applications

l More Topics...

Call for Papers

We encourage the study and exchange of theories and technologies in the fields of wide band gap semiconductor material growth, device fabrication and packaging, module application, etc,. We welcome professional and technical personnel in the related fields from domestic and overseas universities, research institutes and enterprises to submit papers and participate in the conference!

The outstanding papers selected by the organizing committee will have the opportunity to make oral presentation or poster display in the conference!

Scope

Technical reports or temporary result reports focusing on wide bandgap semiconductor, with innovative value in the theory or application practice as well as scientific basis and reliable data are acceptable. Prospective review papers of frontier technology and are of guiding significance to the development of the wide bandgap semiconductors are also acceptable, whose topics include but not limit to:

l Materials Growth and Processing

l Materials Defects and Characterization

l Equipment design, Process and Characteristics

l Device Design, Process and Test

l Device, Module Packaging, Reliability and Applications

Requirement:

(1) Papers will be accepted in English only, either in abstract or full text;

(2) Specific, highlighting innovative research results, with important academic value or popularization and application value;

(3) Original paper, overview, summary of work experience or technical progress report (not involving any infringement issues);

(4) No state secrets shall be involved;

(5) No less than 2 pages (On the first page, only text allowed, and on the second page is the important figures, tables, and data);

(6) The abstract template is detailed in Attachment 1;