Call For Papers

Call For Papers

In the past few years, silicon carbide and other wide bandgap semiconductors have become the commanding point of competition in global high-tech fields and the hottest topic in research and development of international semiconductor community. Based on wide bandgap semiconductor materials, semiconductor lighting technology has formed a huge industry and the electronic power device industry is booming.

The international conference of ICSCRM（International Conference on Silicon Carbide and Related Materials）and ECSCRM（European Conference on Silicon Carbide and Related Materials） have been established, which mainly focus on the development trend of science and technology in the United States, Europe and Japan. To promote the development of silicon carbide and other wide bandgap semiconductors of the Asia-Pacific region, The Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2018) sponsored by IAWBS (Innovation Association of Wide Bandgap Semiconductor Technology, China), IOP (Institute of physics, Chinese Academy of Sciences) and Beijing Ceramic Society will be held at July 9~12, 2018 in Beijing with nearly 400 participants. The basic information of the conference is as follows: www.apcscrm2018.iawbs.com

APCSCRM 2018 will involve several topics related to Bulk and Epitaxial Growth, Material Structure and Property, Photoelectron & Electronic device and Related Equipment, which provide a platform to discuss and communicate the state-of-art progresses of fundamental and application areas. We believe APCSCRM 2018 will certainly give a big push to the academic, technological and industrial development of wide bandgap materials and devices, and thus greatly enhance collaborations and extend industry outreach in the Asia-Pacific region.

APCSCRM will be a high level conference of silicon carbide and related materials in the Asia-pacific region. Starting in 2018, the conference will be held annually at different locations in the Asia-pacific region.

To encourage the theory and technology learning and communication in the fields of wide bandgap semiconductor material growth, device preparation and packaging, and device module application, the conference will conduct a paper exchange , we welcome the domestic and foreign universities, research institutes and enterprises institutions of wide bandgap semiconductor materials and devices, professional and technical personnel in the field of application contribute and participate in the exchange. Selected papers presented in APCSCRM2018 will be published in “Materials Express” ，“Diamond and Related Materials”，“Journal of Crystal Growth”，“physica status solidi (a)”or “Materials science forum ” subject to the journal's standard review process and payment. Some excellent paper authors have the opportunity to make oral presentations or bulletin boards in the venue. The relevant matters are hereby notified as follows: 

I. Topics.

Technical papers addressing all aspects of wide-bandgap materials, power electronics, package module and system solution or application are welcome.

II. Manuscript requirements.

1. Accept English manuscripts only;

2. Original, unpublished research results, technical review, work experience summary or technical progress report;

3. The length of the paper is not limited. (The format requirements are shown in appendix 1)

III   SCI/EI/ Scopusin index searching

IV  Submission instructions:

1.Submit draft via APCSCRM website (please refer to appendix 2 for instructions)

2. Abstract submission deadline: May 30, 2018.    

3.Full paper submission deadline: July 5, 2018.    

4.Please keep attention on the review status of the paper (APCSCRM online submission system).

V  Related costs

1.Registration fee

2. Paper fee

Including the layout fee and the review fee, which will be separately charged by the journal editorial department. Please refer to the contact information (see the contact information below).

3. Payment method

(1) Bank transfer

Account name: Innovation Association of Wide Bandgap Semiconductor Technology

Bank Name: BEIJING RURAL COMMERCIAL BANK CO., LTD.

Bank Address: 3F., ShiNong Building, No.9 TianRong street,                                                               DaXing District, BeiJing China

Account No: 0905000103000006397

(in the remittance note "APCSCRM+fee category + remittance unit/author's name");

(2) Online banking, WeChat or alipay online payment (the conference website has payment links)

(payment remark "APCSCRM+ fee category + remittance unit/author's name")

4. Payment before June 9, 2018.(you can get a discount)

VI. The conference papers publishing.

The seleceted papers will be recomended to the following journals: Materials Science Forum(EI),Materials Express (SCI), Diamond and Related Materials(SCI)、Journal of Crystal Growth(SCI), physica status solidi (a)(SCI), and some excellent paper authors have the opportunity to make oral presentations or bulletin boards in the venue.

VII. Submission of contact information.

Contact: Miss Yaping Li

Telephone:8610-61256850-668

Mobile: +86 18910807823

Email：liyaping@tankeblue.com

Address：3F，Shinong Building, No.9 Tianrong Street, Daxing District, Beijing, China

 appendix 1：Template_General.doc   appendix 2：Contribution System Operating Instructions 20180403.docx